Epitaxy, Chip, Packaging - Unveiling UVLEDTEK's Entire Industry Chain Technology
As a professional supplier of UV LED chips, packaging, and light source systems, Youweixing has a team of senior technical personnel including doctors, postdoctoral fellows, and senior engineers
As a professional supplier of UV LED chips, packaging, and light source systems, Youweixing has a high-level R&D technology team composed of senior technical personnel such as doctors, postdoctoral fellows, and senior engineers
And——
Epitaxial growth - Chip preparation - Device packaging - Light source system
Complete semiconductor UV LED R&D and production line
For a long time, Youweixing has focused on the industrial application of ultraviolet LED. Unlike traditional mercury lamps, UVLEDs emit light by utilizing non-equilibrium carrier radiation recombination near the p-n junction, thereby eliminating energy waste caused by thermal effects. They are also more durable and do not produce electromagnetic pollution
UVLEDs can be divided into three types based on their structure: horizontal, vertical, and inverted. The Youweixing UVA and UVC light sources respectively use the ones located in SuzhouOur own epitaxial chip factoryThe horizontal and inverted products produced
Youweixing UVA-LEDThe preparation process of the light source can be summarized as follows
Epitaxial growth of buffer layer, n-type region, active region, EBL, and p-type region on sapphire substrate in sequence
ITO transparent electrodes and metal electrodes will be deposited on the epitaxial surface of the p-type region, followed by etching one corner of the epitaxial wafer to the n-type region and preparing electrodes on this platform
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Separate packaging. This process involves multiple techniques such as epitaxy, annealing, vapor deposition, polishing, photolithography, etching, and grinding
The epitaxial substrate is the basis for material growth
It is to prepare high-quality productsUVLEDThe primary condition
Youweixing UVC-LEDLight source preparation
It is to invert the horizontal LED on a substrate with high thermal conductivity, which has good heat dissipation performance and is easier to change the series parallel relationship between devices
It lies in its key processing technology - flip chip bonding, a technology that connects device electrodes and substrate wiring layers: first, the surface of the substrate wiring layer is metalized using electron beam evaporation technology, then metal bumps are prepared using wafer ball implantation mechanism, and finally, fully automatic flip chip bonding equipment is used to complete the bonding
extension:
The method of depositing a single crystal thin film with a specific crystal orientation on the surface of a single crystal substrate
Lithography process
Copy the required graphics onto the epitaxial substrate and use etching technology to remove the unnecessary parts, completing the final graphics
1. Evenly coat the surface of the epitaxial wafer with photoresist (a substance that can solidify or melt under specific light) and bake it
2. Position the mask template on the epitaxial wafer and expose it
3. Wash off unwanted photoresist (development) and perform a hard film treatment on the required photoresist
4. After checking the graphics for accuracy, perform etching treatment and remove the remaining photoresist when everything is complete
Etching
Using corrosive gases or liquids to corrode wafers
Vapor deposition process
Weld the electrodes of UVLED
encapsulation
Directly affecting the light output rate and reliability of the device is a key process in device preparation. The encapsulation process can usually be divided into five steps
1. Prepare chips and brackets
2. Solid crystal
3. Pressure welding
4. Sealing
5. Cutting and testing
Youweixing, with full industry chain technology, can provide partners withHigh performance near ultraviolet LED curing equipmentHigh quality deep ultraviolet LED chips/beads and services, with outstanding technological innovation capabilities to create rich ultraviolet industry solutions, build an open and win-win product ecosystem, promote industry standardization construction, and assistAdhesive, paint, ink UV curingVarious industries such as air, water, and surface sterilization have achieved the industrial upgrading of LED
-March 2008-
- October 2015 -
Youweixing has started to develop fiber optic, offset printing, label, and LCD curing light source systems, implementing the "Peak Plan" of research and development, and bravely climbing the high-precision and cutting-edge field of UV curing
Strategic cooperation has been established with leading domestic UV ink suppliers to promote offset printing light sources in bulk. As of July 2019, more than 110 units have been installedRanked No.1 in the domestic offset printing machine modification market share;
The successful installation of the company's first high-power LCD curing surface light source marks the successful entry of the company's products into the LCD cell stage process, which is the first of its kind in China
The Youweixing label flexographic curing light source system breaks through the industry's highest printing speed bottleneck with exclusive process technology, opening the door to cooperation with well-known brand label machine manufacturers
The market of UV label, offset printing, LCD and other light source systems of Youweixing has expanded to Europe, Japan, Thailand, Malaysia, Türkiye, Vietnam, Brazil and other countries, and its overseas performance has achieved rapid growth
Wuhan Youweixing Technology Co., Ltd
Address: 5th Floor, Building B, R&D Building 1, Modern Service Industry Base, Huagong Science and Technology Park, Donghu New Technology Development Zone, Wuhan City
Postal Code: 430223
Contact number: (+86) 027-87971689
Contact email: sales@uvledtek.com (Sales)
