Packaging core key technologies

Innovatively proposed advanced packaging technology for high-power and high reliability ultraviolet LED devices, achieving efficient heat dissipation and improved light extraction efficiency, reaching the international leading level

Temperature regulation technology

Based on gold tin eutectic flip chip technology, effectively reducing device junction temperature and improving heat dissipation performance

Imitation light extraction

Biomimetic flexible fluororubber packaging technology improves light extraction efficiency by 25.2%

high reliability

Fluorocarbon material has strong anti-aging performance, solving the problems of poor reliability and short life of devices

Advanced packaging technology for innovative high-power and high reliability ultraviolet LED devices

Through the use of gold tin eutectic inversion and biomimetic flexible fluororubber packaging technology, efficient heat dissipation and light extraction efficiency are achieved

Temperature control of UV LED devices based on gold tin eutectic inversion

By using gold tin eutectic flip chip technology and optimizing the heat conduction path, the device junction temperature is effectively reduced and the heat dissipation performance is improved

Device structure hierarchy
UV-LED chip 90 µm
AuSn layer eutectic bonding
Aluminum Oxide Ceramic Substrate 0. 35 µm, 20 W/mK
Aluminum plate 1. 6 mm
TIM thermal interface material 250 µm, 1 W/mK
thermal resistance model
Source electrode
Rth jc (junction to shell thermal resistance)
Rth gl (adhesive layer thermal resistance)
Rth TIM (TIM Thermal Resistance)
Tj (junction temperature) target control
The influence of porosity on thermal performance
Sample A
Porosity: 3%
Maximum temperature: 49.9 ° C
Sample B
Porosity: 10%
Maximum temperature: 54.4 ° C
Sample C
Porosity: 20%
Maximum temperature: 60.4 ° C
Sample D
Porosity: 30%
Maximum temperature: 68.4 ° C

Improvement of light extraction efficiency of biomimetic flexible fluororubber encapsulated devices

Based on the biomimetic structure of butterfly wings, flexible fluororubber film (FFP Film) packaging technology is adopted to significantly improve light extraction efficiency

Biomimetic structural features
Principle of structural color of butterfly wings
Highly ordered periodic nanostructures
Moth eye pattern observed by SEM
Comparison of Light Extraction Efficiency
FFP Film: Significant improvement
Smooth: Benchmark Comparison
Increase rate: 25.2%
Polarization mode analysis
TE mode (horizontal electric) FFP Film Enhancement
TM mode (transverse magnetic) FFP Film Enhancement
Light propagation angle 0°-70°

Technological achievements and intellectual property rights

Innovative achievements based on advanced packaging technology have been recognized by Nobel laureates, reaching an international leading level

core patents

Nanoarray structured thin films, preparation methods, and LED devices
Patent number: ZL201811141716.8
Fluororesin interface agent, preparation and usage method for LED packaging
Patent number: ZL201710515884.8

Representative paper

ACS Applied Materials & Interfaces
2019, 11. 21: 19623-19630
IEEE Transactions on Electron Devices
2017, 64. 3: 1174-1179

Technical advantages

Efficient heat dissipation
Reduce the porosity and thermal resistance of the bonding layer
Strong aging resistance
Fluorine rubber material is resistant to UV aging

Evaluation of Nobel laureates

Amamo, winner of the 2014 Nobel Prize in Physics

The gold tin eutectic inverted deep ultraviolet LED chip packaging technology can provide an effective heat dissipation path for the device

Summary of Technical Advantages

Advanced packaging technology of gold tin eutectic and flexible fluorine adhesive flip chip
Reduce the porosity and thermal resistance of the bonding layer
Fluorine adhesive material exhibits strong resistance to UV aging performance
Addressing the issues of poor reliability and short lifespan of devices
Develop efficient and high-power ultraviolet LED devices
Reaching the international leading level