Packaging core key technologies
Innovatively proposed advanced packaging technology for high-power and high reliability ultraviolet LED devices, achieving efficient heat dissipation and improved light extraction efficiency, reaching the international leading level
Temperature regulation technology
Based on gold tin eutectic flip chip technology, effectively reducing device junction temperature and improving heat dissipation performance
Imitation light extraction
Biomimetic flexible fluororubber packaging technology improves light extraction efficiency by 25.2%
high reliability
Fluorocarbon material has strong anti-aging performance, solving the problems of poor reliability and short life of devices
Advanced packaging technology for innovative high-power and high reliability ultraviolet LED devices
Through the use of gold tin eutectic inversion and biomimetic flexible fluororubber packaging technology, efficient heat dissipation and light extraction efficiency are achieved
Temperature control of UV LED devices based on gold tin eutectic inversion
By using gold tin eutectic flip chip technology and optimizing the heat conduction path, the device junction temperature is effectively reduced and the heat dissipation performance is improved
Improvement of light extraction efficiency of biomimetic flexible fluororubber encapsulated devices
Based on the biomimetic structure of butterfly wings, flexible fluororubber film (FFP Film) packaging technology is adopted to significantly improve light extraction efficiency
Technological achievements and intellectual property rights
Innovative achievements based on advanced packaging technology have been recognized by Nobel laureates, reaching an international leading level
core patents
Representative paper
Technical advantages
Evaluation of Nobel laureates
Amamo, winner of the 2014 Nobel Prize in Physics
The gold tin eutectic inverted deep ultraviolet LED chip packaging technology can provide an effective heat dissipation path for the device