Core key technologies of epitaxial materials

Innovatively proposing high-quality ultraviolet radiation LED Defects in epitaxial materials and stress control technology, Realize UV LED The dislocation density of the material decreases to 3×10⁸ cm⁻², Reaching the international advanced level

Dislocation density control

The dislocation density decreases to 3×10⁸ cm⁻², Reaching the international advanced level

Effective stress release

Innovation Pyramid Nanographization NPSS Substrate epitaxial growth healing technology

Nobel laureates recognized

2014 Nobel Prize winner in Physics Nakamura highly praise

Innovative High Quality UV LED Defects in epitaxial materials and stress control technology

By visualizing the substrate, thickness control, Dislocation merging and stress release technology, Achieve breakthrough improvement in the quality of epitaxial materials

Graphic substrate surface morphology

Using atomic force microscope (AFM) Observing the graphical substrate surface, A pyramid or conical structure arranged in a regular pattern, uniform distribution, Provide an ideal template for epitaxial growth.

surface feature
Pyramid shaped microstructure array
Regular grid arrangement
3D Surface morphology control

Thickness exceeds 10µm

scanning electron microscope (SEM) Cross sectional image display AlN Growth of Layer on Sapphire Substrate, Thickness exceeds 10µm, It includes vertically extending air holes.

Material structure hierarchy
AlN layer thickness ' 10µm
Air hole Vertical extension
Sapphire h = 6. 6µm

Bending annihilation during dislocation merging process

transmission electron microscope (TEM) Image displays the bending of dislocation defects in the epitaxial layer during the growth process, Merge and Annihilation Process, Effectively reduce defect density.

Dislocation control mechanism
Dislocation bending
Dislocation merging
Dislocation annihilation

Effective stress release

Reciprocal space mapping (RSM) Analyze and display the stress state and crystal quality in the material, Realize high-quality epitaxial growth through effective stress relief technology.

Stress analysis parameters
Qx×10000 (rlu) 2810-2880
Qz×10000 (rlu) 7715-7750
Stress state Effective Release

Technological achievements and intellectual property rights

Innovative achievements based on epitaxial technology recognized by Nobel laureates, And successfully applied to satellite detection engineering

core patent

Ultra wide bandgap aluminum nitride epitaxial wafers and their preparation methods
Patent Number: ZL201811380251. 1
A deep ultraviolet LED Heterogeneous epitaxial substrates and their preparation methods and applications
Patent Number: ZL202110397975. 2

Representative Paper

Applied Physics Letters
2019, 114. 4
Optics Express
2018, 26. 2: 680-686

Application achievements

"Ocean No. 1"Satellite Exploration Engineering
Online monitoring of marine environment
AlGaN material application
Successfully applied to satellite systems

Evaluation of Nobel laureates

2014 Nobel Prize winner in Physics Nakamura

"This technological innovation is expected to achieve low dislocation density through novel growth methods and annealing techniques AlN/NPSS become a reality"

Summary of Technical Advantages

Innovation Pyramid Nanographization NPSS Substrate technology
Effective release of stress and promotion of error control
The dislocation density decreases to 3×10⁸ cm⁻²
Reaching the international advanced level
Successfully applied to satellite exploration engineering
Highly praised by Nobel laureates
0.953423s