Packaging core key technologies

Innovatively propose high-power, high reliability ultraviolet LED Advanced packaging technology for devices, Realize efficient heat dissipation and improve light extraction efficiency, Reaching the international leading level

Temperature regulation technology

Based on gold tin eutectic inversion technology, Effectively reduce device junction temperature, Improve heat dissipation performance

Imitation light extraction

Biomimetic flexible fluororubber packaging technology, Improved light extraction efficiency 25. 2%

high reliability

Strong aging resistance of fluororubber material, Addressing the issues of poor reliability and short lifespan of devices

Innovative high-power, high reliability UV LED Advanced packaging technology for devices

Through gold tin eutectic inversion and biomimetic flexible fluororubber packaging technology, Realize efficient heat dissipation and improve light extraction efficiency

UV based on gold tin eutectic inversion LED Device junction temperature control

Adopting gold tin eutectic inversion technology, By optimizing the heat conduction path, Effectively reduce device junction temperature, Improve heat dissipation performance.

Device structure hierarchy
UV-LED chip 90 µm
AuSn layer eutectic bonding
Al₂O₃Ceramic substrate 0. 35 µm, 20 W/mK
aluminum plate 1. 6 mm
TIM Thermal interface material 250 µm, 1 W/mK
thermal resistance model
source →
Rth-jc (Thermal resistance to the shell) →
Rth-gl (Adhesive layer thermal resistance) →
Rth-TIM (TIM thermal resistance) →
Tj (junction temperature) target control
The influence of porosity on thermal performance
sample A
porosity: 3%
maximum temperature: 49. 9°C
sample B
porosity: 10%
maximum temperature: 54. 4°C
sample C
porosity: 20%
maximum temperature: 60. 4°C
sample D
porosity: 30%
maximum temperature: 68. 4°C

Improvement of light extraction efficiency of biomimetic flexible fluororubber encapsulated devices

Based on the biomimetic structure of butterfly wings, Using flexible fluorine adhesive film (FFP Film) packaging technology, Significantly improve light extraction efficiency.

Biomimetic structural features
Principle of structural color of butterfly wings
Highly ordered periodic nanostructures
SEM Observed moth eye pattern
Comparison of Light Extraction Efficiency
FFP Film: significantly improve
Smooth: Benchmark comparison
increase margin: 25. 2%
Polarization mode analysis
TE pattern (Transverse electricity) FFP Film enhance
TM pattern (Transverse magnetic field) FFP Film enhance
Light propagation angle 0°-70°

Technological achievements and intellectual property rights

Innovative achievements based on advanced packaging technology recognized by Nobel laureates, Reaching the international leading level

core patent

Nano array structured thin film, Preparation method and LED device
Patent Number: ZL201811141716. 8
for LED Encapsulated fluororesin interface agent, Preparation and usage methods
Patent Number: ZL201710515884. 8

Representative Paper

ACS Applied Materials & Interfaces
2019, 11. 21: 19623-19630
IEEE Transactions on Electron Devices
2017, 64. 3: 1174-1179

technical advantage

Efficient heat dissipation
Reduce the porosity and thermal resistance of the bonding layer
Strong aging resistance
Fluorine rubber material is resistant to UV aging

Evaluation of Nobel laureates

2014 Nobel Prize winner in Physics Amamo

"Gold tin eutectic inverted deep ultraviolet LED Chip packaging technology can provide effective heat dissipation paths for devices"

Summary of Technical Advantages

Advanced packaging technology of gold tin eutectic and flexible fluorine adhesive flip chip
Reduce the porosity and thermal resistance of the bonding layer
Fluorine adhesive material exhibits strong resistance to UV aging performance
Addressing the issues of poor reliability and short lifespan of devices
Develop efficient and high-power ultraviolet technology LED device
Reaching the international leading level